DUOBO 3.0W/M.K Silicone Thermal Grease is an advanced thermal interface material specifically engineered for high-power and high-end electronic devices. This premium-grade silicone-based grease delivers exceptional thermal conductivity, addressing the critical challenge of efficient heat dissipation in power-intensive applications. By employing this thermal grease, users can significantly enhance the thermal performance and reliability of their electronic systems, leading to improved device longevity and stability.

High Thermal Conductivity: Boasting a thermal conductivity of 3.0W/M.K, it ensures superior heat dissipation, crucial for preventing overheating in high-power components.

Excellent Stability: Designed to maintain optimal thermal performance over a broad temperature range, ensuring consistent reliability in demanding environments.

Ease of Application: The silicone-based formulation is easy to spread and ensures a smooth application, effectively filling microscopic gaps for maximum thermal transfer.

Non-Corrosive and Safe: The grease is non-corrosive to metals, safeguarding sensitive components and ensuring long-term protection.

Low Thermal Resistance: Reduces thermal resistance at the interface, enhancing overall thermal efficiency and performance.

Preparation: Thoroughly clean the surfaces of the heat-generating component and the heat sink to remove any old thermal material, dust, or debris.
Application: Apply a small amount of 3.0W/M.K Silicone Thermal Grease onto the surface of the heat-generating component.
Spreading: Use a flat tool (such as a spatula or a card) to spread the grease evenly, creating a thin, uniform layer that covers the entire surface.
Assembly: Carefully align and place the heat sink onto the component to ensure proper contact.
Securing: Secure the heat sink as per the device’s specifications, ensuring firm and stable contact.

High-Power Computing Systems: Ideal for CPUs and GPUs in high-performance computing and gaming setups, providing efficient thermal management.
LED Lighting Systems: Enhances heat dissipation in high-power LED applications, extending the lifespan and reliability of lighting systems.
Power Electronics: Perfect for use in high-power inverters, power modules, and other critical power electronics requiring effective thermal management.
Automotive Electronics: Essential for electronic control units (ECUs), power control units, and other high-end automotive electronics to prevent overheating.
High-End Consumer Electronics: Suitable for advanced smartphones, tablets, and gaming consoles that demand superior thermal performance.

Testing Item	Unit	Testing Method	Testing Value
Colour	-	Visual	Grey or customized
Thermal Resistance	℃-in2/W	ASTM D1470	<0.15
Component Ratio	-	ASTMD1475	＞2.5
Evaporation	%	Fed.Std.791	＜0.001
Oil Precipitation	%	Fed.Std.791	＜0.05
Dielectric Constant	-	ASTM D150	＞5
Viscosity	( mPa.s@25℃)	DHR-2	(300~400)*104
Cone Penetration	-	GB/T-269	410±10
Working Temperature	℃	-	-40~200℃
Flaming Rating	-	UL 94	V0
Weight loss	%	@200°200H	＜1
Thermal Conductivity	W/M.K	ASTM D5470	3.0