2.0W/M.K Silicone Thermal Grease
2.0W/M.K Silicone Thermal Grease

2.0W/M.K Silicone Thermal Grease

2.0W/M.K Silicone Thermal Grease

Conductivity:2.0W/M.K

Resistance:≤0.2℃-in²/W

Working Temperature:-40-200℃

Certification:ROHS,REACH


Conductivity:2.0W/M.K

Resistance:≤0.2℃-in²/W

Working Temperature:-40-200℃

Certification:ROHS,REACH


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2.0W/M.K Silicone Thermal Grease Apply For Quotation
Introduction

DUOBO 2.0W/M.K Silicone Thermal Grease is meticulously engineered to excel in today's high-performance electronic environments, addressing the critical need for efficient heat dissipation. This premium-grade compound stands out as a game-changer in thermal management solutions, specifically designed to tackle excessive heat generation in power-intensive applications. By employing our advanced silicone-based formula, users can expect not only enhanced cooling capabilities but also prolonged equipment lifespan and optimized operational efficiency. Experience the peace of mind that comes with knowing your high-end electronics are running cooler and more reliably than ever before.

Features

Exceptional Thermal Conductivity: With a thermal conductivity rating of 2.0 W/M.K, this grease facilitates rapid heat transfer from hotspots to heat sinks, ensuring optimal temperature control.

Wide Operating Temperature Range: From extreme lows to soaring highs, our silicone thermal grease maintains its performance integrity between -50°C to 200°C, making it suitable for demanding environments.

Low Bleed and Pump-out Resistance: Formulated to resist migration and pump-out, ensuring consistent thermal contact over extended periods without drying out or cracking.

Non-Corrosive & Electrically Insulating: Safe for use on all electronic components, preventing short circuits and corrosion, thereby safeguarding sensitive electronics.

Easy Application & Removal: Its pliable nature allows for effortless spreading while ensuring a clean, mess-free experience during application or rework.


Application method

For best results, ensure the surface is clean, dry, and free from debris before application. Apply a thin, even layer onto the heating component or directly onto the heat sink surface, using a spatula or similar tool to spread evenly. Avoid excessive pressure to prevent air pockets. For optimal thermal conductivity, it's recommended to reapply after disassembly or every 1-2 years for continuous high-performance systems.

Application
Gaming Laptops & Desktop PCs
High-Performance CPUs and GPUs
Advanced Server Systems
LED Lighting Systems
Telecommunication Equipment
Power Supply Units (PSUs)
Renewable Energy Systems (Solar Inverters, etc.)
Specification

Testing Item

Unit

Testing Method

Testing Value

Colour

-

Visual

Grey or customized

Thermal Resistance

℃-in2/W

ASTM D1470

≤0.12

Component Ratio

-

ASTMD1475

2.0

Evaporation

%

Fed.Std.791

0.001

Oil Precipitation

%

Fed.Std.791

0.05

 Dielectric Constant

-

ASTM D150

5

Viscosity

( mPa.s@25℃)

DHR-2

(200~400)*104

Cone Penetration

1/10 MM

GB/T-269

410±10

Flaming Rating

-

UL 94

V0

Working Temperature

-

-40~200

Weight loss

%

@200°200H

1

density

g/cc

ASTM D792

2.8(±0.3 )

Thermal Conductivity

W/M.K

ASTM D5470

2.0

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