Thermal Conductivity: 8.0W/M.K
Working Temperature: -40-200℃
Thickness: 0.75-10MM or Customized
Hardness:30-50 shore C
Flaming Rating: UL94 V-0
Certificates: UL,RoHS,Reach
Thermal Conductivity: 8.0W/M.K
Working Temperature: -40-200℃
Thickness: 0.75-10MM or Customized
Hardness:30-50 shore C
Flaming Rating: UL94 V-0
Certificates: UL,RoHS,Reach
The 8.0 W/m·K Silicone Thermal Pad is a cutting-edge thermal interface material designed to address the challenges of heat dissipation in high-power electronic devices. With superior thermal conductivity, this pad ensures efficient heat transfer, protecting components from overheating and enhancing overall performance. Ideal for high-end electronic applications, it offers a reliable solution to maintain optimal operating temperatures and prolong device lifespan.
Exceptional Thermal Conductivity: Boasting a thermal conductivity of 8.0 W/m·K, this pad provides outstanding heat transfer, effectively dissipating heat from high-power components.
Superior Electrical Insulation: Ensures excellent dielectric strength, safeguarding sensitive electronic components from electrical shorts.
Flexible and Conformable: The pad’s softness allows it to conform to surface irregularities, ensuring better contact and improved thermal efficiency.
Testing Item | Testing Value | Testing Method |
Thickness(MM) | 0.75-10MM or Customized | ASTM D374 |
Components | Silicone Rubber &Ceramics | -- |
Colour | Grey or Customized | Visual |
Hardness (Shore C) | 30-50 | ASTM D2240 |
Density(G/M3) | 3.3±0.1 | ASTM D792 |
Tensile Strength(KN/M) | 0.1 | ASTM D412 |
Extensibility(%) | 30 | ASTM D374 |
Working Temperature(℃) | -40~200 | EN344 |
Breakdown Voltage(KV) | >10 | ASTM D149 |
Volume Resistivity(Ω·CM) | 1.5×1011 | ASTM D257 |
Dielectric Constant(@1MHz) | 8 | ASTM D150 |
Weight Loss ratio (%) | <0.5 | @200℃240H |
Flaming Rating | V-0 | UL-94 |
Standard Size(W*L:MM) | 200X300 | - |
Thermal Conductivity(W/M.K) | 8.0 | ASTM D5470 |