8.0W/M.K Silicone Thermal Pad
8.0W/M.K Silicone Thermal Pad

8.0W/M.K Silicone Thermal Pad

8.0W/M.K Silicone Thermal Pad

Thermal Conductivity: 8.0W/M.K

Working Temperature: -40-200℃

Thickness: 0.75-10MM or Customized

Hardness:30-50 shore C

Flaming Rating: UL94 V-0

Certificates: UL,RoHS,Reach


Thermal Conductivity: 8.0W/M.K

Working Temperature: -40-200℃

Thickness: 0.75-10MM or Customized

Hardness:30-50 shore C

Flaming Rating: UL94 V-0

Certificates: UL,RoHS,Reach


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8.0W/M.K Silicone Thermal Pad Apply For Quotation
Introduction

The 8.0 W/m·K Silicone Thermal Pad is a cutting-edge thermal interface material designed to address the challenges of heat dissipation in high-power electronic devices. With superior thermal conductivity, this pad ensures efficient heat transfer, protecting components from overheating and enhancing overall performance. Ideal for high-end electronic applications, it offers a reliable solution to maintain optimal operating temperatures and prolong device lifespan.

Features

Exceptional Thermal Conductivity: Boasting a thermal conductivity of 8.0 W/m·K, this pad provides outstanding heat transfer, effectively dissipating heat from high-power components.

Superior Electrical Insulation: Ensures excellent dielectric strength, safeguarding sensitive electronic components from electrical shorts.

Flexible and Conformable: The pad’s softness allows it to conform to surface irregularities, ensuring better contact and improved thermal efficiency.

Durability and Reliability: Resistant to environmental stressors such as moisture, temperature fluctuations, and mechanical pressure, ensuring long-term performance stability.

Application
High-Performance Servers and Data Centers: Essential for cooling high-power processors, memory modules, and power supplies, ensuring efficient operation and reliability.
Advanced Gaming Consoles: Ideal for managing the substantial heat generated by powerful CPUs and GPUs in next-generation gaming consoles.
Telecommunications Infrastructure: Perfect for base stations, network switches, and other high-power telecom equipment requiring dependable thermal management.
Electric Vehicles (EVs): Crucial for efficient heat dissipation in battery packs, inverters, and electronic control units (ECUs), enhancing performance and safety.
Medical Imaging Equipment: Vital for maintaining stable temperatures in high-power medical imaging devices, ensuring precise and reliable performance.
Industrial Automation Systems: Suitable for cooling high-power industrial control systems, motor drives, and other automation equipment, improving reliability and efficiency.
Renewable Energy Systems: Applied in solar inverters, wind turbine electronics, and other renewable energy systems, where efficient thermal management is key to optimal performance and longevity.
Specification
Testing ItemTesting ValueTesting Method
Thickness(MM)0.75-10MM or CustomizedASTM D374
ComponentsSilicone Rubber &Ceramics--
ColourGrey or CustomizedVisual
Hardness (Shore C)30-50ASTM D2240
Density(G/M3)3.3±0.1ASTM D792
Tensile Strength(KN/M)0.1ASTM D412
Extensibility(%)30ASTM D374
Working Temperature(℃)-40~200EN344
Breakdown Voltage(KV)>10ASTM D149
Volume Resistivity(Ω·CM)1.5×1011ASTM D257
Dielectric Constant(@1MHz)8ASTM D150
Weight Loss ratio (%)0.5@200℃240H
Flaming RatingV-0UL-94
Standard Size(W*L:MM)200X300-
Thermal Conductivity(W/M.K)8.0ASTM D5470
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