7.0W/M.K Silicone Thermal Pad
7.0W/M.K Silicone Thermal Pad

7.0W/M.K Silicone Thermal Pad

7.0W/M.K Silicone Thermal Pad

Thermal Conductivity: 7.0W/M.K

Working Temperature: -40-200℃

Thickness: 0.75-10MM or Customized

Hardness:30-50 shore C

Flaming Rating: UL94 V-0

Certificates: UL,RoHS,Reach


Thermal Conductivity: 7.0W/M.K

Working Temperature: -40-200℃

Thickness: 0.75-10MM or Customized

Hardness:30-50 shore C

Flaming Rating: UL94 V-0

Certificates: UL,RoHS,Reach


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7.0W/M.K Silicone Thermal Pad Apply For Quotation
Introduction

The 7.0 W/m·K Silicone Thermal Pad is a high-performance thermal interface material designed to provide superior heat dissipation in high-power electronic applications. Made from premium silicone, this thermal pad ensures excellent thermal conductivity, making it ideal for high-end electronic devices requiring efficient thermal management.

The 7.0 W/m·K Silicone Thermal Pad is engineered to meet the rigorous thermal management requirements of high-power, high-end electronic devices, ensuring optimal performance, reliability, and longevity.

Features

Exceptional Thermal Conductivity: With a thermal conductivity of 7.0 W/m·K, this pad offers outstanding heat transfer capabilities, ensuring critical components remain within safe operating temperatures.

Superior Electrical Insulation: The silicone material provides excellent dielectric strength, protecting sensitive electronic components from electrical shorts.

Highly Flexible and Conformable: Soft and pliable, the pad easily conforms to the surface irregularities of electronic components, improving thermal contact and heat transfer efficiency.

Durable and Reliable: Resistant to environmental factors such as moisture, temperature fluctuations, and mechanical stress, ensuring long-lasting performance and reliability.


Application

High-Performance Servers and Data Centers: Critical for cooling processors, memory modules, and power supplies in high-performance servers and data center equipment.
Advanced Gaming Consoles: Ideal for managing the significant heat generated by powerful CPUs and GPUs in next-generation gaming consoles.
Telecommunications Infrastructure: Perfect for base stations, network switches, and other high-power telecom equipment requiring reliable thermal management.
Electric Vehicles (EVs): Essential for efficient heat dissipation in battery packs, power inverters, and electronic control units (ECUs) in electric vehicles.
Medical Imaging Equipment: Crucial for thermal management in high-power medical imaging devices, ensuring stable and accurate performance.
Industrial Automation Systems: Suitable for cooling high-power industrial control systems, motor drives, and other automation equipment.
Renewable Energy Systems: Applied in solar inverters, wind turbine electronics, and other renewable energy systems where efficient thermal management is vital for performance and longevity.

Specification
Testing ItemTesting ValueTesting Method
Thickness(MM)0.75-10MM or CustomizedASTM D374
ComponentsSilicone Rubber &Ceramics--
ColourGrey or CustomizedVisual
Hardness (Shore C)30-50ASTM D2240
Density(G/M3)3.3±0.1ASTM D792
Tensile Strength(KN/M)0.1ASTM D412
Extensibility(%)30ASTM D374
Working Temperature(℃)-40~200EN344
Breakdown Voltage(KV)>4ASTM D149
Volume Resistivity(Ω·CM)1.5×1011ASTM D257
Dielectric Constant(@1MHz)8ASTM D150
Weight Loss ratio (%)1@200℃240H
Standard Size(W*L:MM)200*400-
Flaming RatingV-0UL-94
Thermal Conductivity(W/M.K)7.0ASTM D5470
1:The data of conductive interface sheet is just for reference.
2:Different thermal conductive pad has different application areas,
3.Any application solution question,welcome to check with our team.
4 Sheet size&shape can be cut as customized.
5.Adhesive and reinforce fiberglass can be added as requested.
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