Thermal Conductivity: 7.0W/M.K
Working Temperature: -40-200℃
Thickness: 0.75-10MM or Customized
Hardness:30-50 shore C
Flaming Rating: UL94 V-0
Certificates: UL,RoHS,Reach
Thermal Conductivity: 7.0W/M.K
Working Temperature: -40-200℃
Thickness: 0.75-10MM or Customized
Hardness:30-50 shore C
Flaming Rating: UL94 V-0
Certificates: UL,RoHS,Reach
The 7.0 W/m·K Silicone Thermal Pad is a high-performance thermal interface material designed to provide superior heat dissipation in high-power electronic applications. Made from premium silicone, this thermal pad ensures excellent thermal conductivity, making it ideal for high-end electronic devices requiring efficient thermal management.
The 7.0 W/m·K Silicone Thermal Pad is engineered to meet the rigorous thermal management requirements of high-power, high-end electronic devices, ensuring optimal performance, reliability, and longevity.
Exceptional Thermal Conductivity: With a thermal conductivity of 7.0 W/m·K, this pad offers outstanding heat transfer capabilities, ensuring critical components remain within safe operating temperatures.
Superior Electrical Insulation: The silicone material provides excellent dielectric strength, protecting sensitive electronic components from electrical shorts.
Highly Flexible and Conformable: Soft and pliable, the pad easily conforms to the surface irregularities of electronic components, improving thermal contact and heat transfer efficiency.
High-Performance Servers and Data Centers: Critical for cooling processors, memory modules, and power supplies in high-performance servers and data center equipment.
Advanced Gaming Consoles: Ideal for managing the significant heat generated by powerful CPUs and GPUs in next-generation gaming consoles.
Telecommunications Infrastructure: Perfect for base stations, network switches, and other high-power telecom equipment requiring reliable thermal management.
Electric Vehicles (EVs): Essential for efficient heat dissipation in battery packs, power inverters, and electronic control units (ECUs) in electric vehicles.
Medical Imaging Equipment: Crucial for thermal management in high-power medical imaging devices, ensuring stable and accurate performance.
Industrial Automation Systems: Suitable for cooling high-power industrial control systems, motor drives, and other automation equipment.
Renewable Energy Systems: Applied in solar inverters, wind turbine electronics, and other renewable energy systems where efficient thermal management is vital for performance and longevity.
Testing Item | Testing Value | Testing Method |
Thickness(MM) | 0.75-10MM or Customized | ASTM D374 |
Components | Silicone Rubber &Ceramics | -- |
Colour | Grey or Customized | Visual |
Hardness (Shore C) | 30-50 | ASTM D2240 |
Density(G/M3) | 3.3±0.1 | ASTM D792 |
Tensile Strength(KN/M) | 0.1 | ASTM D412 |
Extensibility(%) | 30 | ASTM D374 |
Working Temperature(℃) | -40~200 | EN344 |
Breakdown Voltage(KV) | >4 | ASTM D149 |
Volume Resistivity(Ω·CM) | 1.5×1011 | ASTM D257 |
Dielectric Constant(@1MHz) | 8 | ASTM D150 |
Weight Loss ratio (%) | <1 | @200℃240H |
Standard Size(W*L:MM) | 200*400 | - |
Flaming Rating | V-0 | UL-94 |
Thermal Conductivity(W/M.K) | 7.0 | ASTM D5470 |
1:The data of conductive interface sheet is just for reference. 2:Different thermal conductive pad has different application areas, 3.Any application solution question,welcome to check with our team. 4 Sheet size&shape can be cut as customized. 5.Adhesive and reinforce fiberglass can be added as requested. |