Thermal Conductivity: 6.0W/M.K
Working Temperature: -40-200℃
Thickness: 0.5-10MM or Customized
Hardness:20-50 shore C
Flaming Rating: UL94 V-0
Certificates: UL,RoHS,Reach
Thermal Conductivity: 6.0W/M.K
Working Temperature: -40-200℃
Thickness: 0.5-10MM or Customized
Hardness:20-50 shore C
Flaming Rating: UL94 V-0
Certificates: UL,RoHS,Reach
DUOBO 6.0 W/m·K Silicone Thermal Pad is a premium thermal interface material designed to deliver exceptional heat dissipation in high-power electronic applications. Constructed from high-quality silicone, this thermal pad offers superior thermal conductivity, ensuring efficient thermal management for advanced electronic devices.
The 6.0 W/m·K Silicone Thermal Pad is designed to meet the demanding thermal management needs of high-power, high-end electronic devices, ensuring optimal performance, reliability, and longevity.
High Thermal Conductivity: Boasting a thermal conductivity of 6.0 W/m·K, this pad excels in transferring heat away from critical components, ensuring they operate within optimal temperature ranges.
Excellent Electrical Insulation: Provides strong dielectric properties to prevent electrical shorts and protect sensitive electronic components.
Flexible and Conformable: The soft silicone material conforms easily to the surface irregularities of electronic components, enhancing thermal contact and heat transfer efficiency.
Testing Item | Testing Value | Testing Method |
Thickness(MM) | 0.5-10MM or Customized | ASTM D374 |
Components | Silicone Rubber &Ceramics | -- |
Colour | Grey or Customized | Visual |
Hardness (Shore C) | 30-50 | ASTM D2240 |
Density(G/M3) | 3.3±0.1 | ASTM D792 |
Tensile Strength(KN/M) | 0.1 | ASTM D412 |
Extensibility(%) | 30 | ASTM D374 |
Working Temperature(℃) | -40~200 | EN344 |
Breakdown Voltage(KV) | >4 | ASTM D149 |
Volume Resistivity(Ω·CM) | 1.5×1011 | ASTM D257 |
Dielectric Constant(@1MHz) | 7.6 | ASTM D150 |
Weight Loss ratio (%) | <1 | @200℃240H |
Flaming Rating | V-0 | UL-94 |
Thermal Conductivity(W/M.K) | 6.0 | ASTM D5470 |