6.0W/M.K Silicone Thermal Pad
6.0W/M.K Silicone Thermal Pad

6.0W/M.K Silicone Thermal Pad

6.0W/M.K Silicone Thermal Pad

Thermal Conductivity: 6.0W/M.K

Working Temperature: -40-200℃

Thickness: 0.5-10MM or Customized

Hardness:20-50 shore C

Flaming Rating: UL94 V-0

Certificates: UL,RoHS,Reach


Thermal Conductivity: 6.0W/M.K

Working Temperature: -40-200℃

Thickness: 0.5-10MM or Customized

Hardness:20-50 shore C

Flaming Rating: UL94 V-0

Certificates: UL,RoHS,Reach


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6.0W/M.K Silicone Thermal Pad Apply For Quotation
Introduction

DUOBO 6.0 W/m·K Silicone Thermal Pad is a premium thermal interface material designed to deliver exceptional heat dissipation in high-power electronic applications. Constructed from high-quality silicone, this thermal pad offers superior thermal conductivity, ensuring efficient thermal management for advanced electronic devices.


The 6.0 W/m·K Silicone Thermal Pad is designed to meet the demanding thermal management needs of high-power, high-end electronic devices, ensuring optimal performance, reliability, and longevity.


Features

High Thermal Conductivity: Boasting a thermal conductivity of 6.0 W/m·K, this pad excels in transferring heat away from critical components, ensuring they operate within optimal temperature ranges.

Excellent Electrical Insulation: Provides strong dielectric properties to prevent electrical shorts and protect sensitive electronic components.

Flexible and Conformable: The soft silicone material conforms easily to the surface irregularities of electronic components, enhancing thermal contact and heat transfer efficiency.

Durable and Reliable: Resistant to environmental factors such as moisture, temperature fluctuations, and mechanical stress, ensuring long-lasting performance and reliability.

Application
High-End Servers and Data Centers: Essential for cooling processors, memory modules, and power supplies in high-performance servers and data centers.
Gaming Consoles: Ideal for managing the heat generated by powerful CPUs and GPUs in next-generation gaming consoles.
Telecommunications Equipment: Perfect for base stations, network switches, and other high-power telecom devices that require reliable thermal management.
Electric Vehicles (EVs): Used in battery packs, inverters, and electronic control units (ECUs) to ensure efficient heat dissipation and reliable operation.
Medical Imaging Devices: Critical for thermal management in high-power medical imaging equipment, ensuring stable and accurate performance.
Industrial Automation: Suitable for cooling high-power industrial control systems, motor drives, and other automation equipment.
Renewable Energy Systems: Applied in solar inverters, wind turbine electronics, and other renewable energy systems where efficient thermal management is crucial for performance and longevity.
Specification
Testing Item Testing Value Testing Method
Thickness(MM) 0.5-10MM or Customized ASTM D374
Components Silicone Rubber &Ceramics --
Colour Grey or Customized Visual
Hardness (Shore C) 30-50 ASTM D2240
Density(G/M3) 3.3±0.1 ASTM D792
Tensile Strength(KN/M) 0.1 ASTM D412
Extensibility(%) 30 ASTM D374
Working Temperature(℃) -40~200 EN344
Breakdown Voltage(KV) >4 ASTM D149
Volume Resistivity(Ω·CM) 1.5×1011 ASTM D257
Dielectric Constant(@1MHz) 7.6 ASTM D150
Weight Loss ratio (%) 1 @200℃240H
Flaming Rating V-0 UL-94
Thermal Conductivity(W/M.K) 6.0  ASTM D5470
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