DUOBO 4.0W/M.K Silicone Thermal Grease is meticulously engineered to excel in high-performance thermal management applications, addressing the critical need for efficient heat dissipation in today's powerful electronic devices. This premium-grade compound stands out by offering unparalleled thermal conductivity of 4.0W/M.K, ensuring optimal heat transfer and significantly reducing thermal resistance. It is specifically designed to solve the prevalent issue of overheating in high-power, cutting-edge electronic components, thereby prolonging device lifespan, enhancing reliability, and preventing performance throttling due to excessive heat. By choosing our thermal grease, users can expect their devices to operate at peak efficiency, maintaining top speeds and consistent performance even under extended heavy loads.

1.Good thixotropism facilitates usage.

2.Good thermal conductivity, low thermal resistance

3.Low evaporation rate,low oil precipitation. 

4.Good extrusion resistance and high reliability for long-term use.

5.Reliable wettability ,excellent insulation, no corrosion or toxic.

6.Good resistance of water,ozone and variety of weather , stable in -40℃～200℃.

Exceptional Thermal Conductivity: 4.0W/M.K ensures rapid heat absorption and transfer, outperforming conventional greases.

Wide Operating Temperature Range: Stays effective from -50°C to 200°C, making it suitable for diverse environmental conditions.

Low Volatility and High Stability: Formulated for long-term stability without hardening, drying, or cracking over time.

Excellent Compatibility: Safe for use on all common electronic materials including metals, ceramics, and plastics, with no corrosion or degradation.

Easy Application and Cleanup: Non-toxic, non-curing formula allows for simple spreading and easy removal for maintenance or upgrades.

Low Bleed and Pump-out Resistance: Minimizes migration or pump-out from joints under extreme conditions, ensuring continued effectiveness.

High-performance CPUs and GPUs in gaming PCs and workstations
Advanced server systems and data center equipment
High-density LED lighting arrays
Power conversion systems and modules
Telecommunication base stations

Testing Item	Unit	Testing Method	Testing Value
Colour	-	Visual	Grey or customized
Thermal Resistance	℃-in2/W	ASTM D1470	≤0.1
Component Ratio	-	ASTMD1475	＞3.15
Evaporation	%	Fed.Std.791	＜0.001
Oil Precipitation	%	Fed.Std.791	＜0.05
Dielectric Constant	-	ASTM D150	＞5
Viscosity	( mPa.s@25℃)	DHR-2	（400~500)*104
Cone Penetration	-	GB/T-269	410±10
Working Temperature	℃	-	-40~200℃
Flaming Rating	-	UL 94	V0
Weight loss	%	@200°200H	＜1
Thermal Conductivity	W/M.K	ASTM D5470	4.0