Duobo Electronics 10:1 potting glue is a two-component silicone sealing material that can be cured at room temperature. It releases ethanol molecules during the curing process and will not corrode PC (Poly-carbonate), PP, ABS, PVC, copper wire and other materials. It has good adhesion to most electronic accessory materials (except PP and PE). It is suitable for potting and waterproof protection of high-end outdoor full-color LED modules.

Low viscosity, good leveling properties, suitable for potting of electronic appliances and lighting;

After curing, it forms a soft rubbery state with good impact resistance;

Condensation type, the released ethanol molecules have no corrosion to components;

It does not shrink during the curing process and has better waterproof, moisture-proof and anti-aging properties;

It has thermal conductivity and flame retardancy, and its flame retardancy reaches UL94-V0 level, and has passed ROHS and Reach certification;

Temperature resistance, good high temperature aging resistance. After curing, the silicone rubber maintains elasticity within the temperature range of (-40 ~ 250 ℃) and has excellent insulation performance;

The operation time of the rubber compound is relatively long after mixing at room temperature, but it can be cured quickly under heating conditions, which is particularly beneficial for use on automatic production lines.

Before mixing, component A needs to be stirred in the bucket at 1500-2000 rpm for 5-7 minutes using manual or mechanical equipment. The stirrer should be placed in the center of the liquid surface, and the depth of the stirrer inserted into the glue should preferably be 1/2-2/3 of the depth of the glue. Component B should be shaken left and right 5-7 times in a sealed state before use.

When mixing, the weight ratio is A: B = 10: 1. If the ratio needs to be changed, it should be tested before actual application. Generally, the more B component is used, the shorter the operation time and curing time. The higher the ambient temperature, the shorter the operation time and curing time. Heating is generally not recommended to avoid pinholes or bubbles on the surface and inside, which will affect the appearance and sealing performance of the product.

The prepared glue must be used up before it gels (obviously thickens), otherwise it will cause waste or affect the potting effect.

Potting of electronic components and modules, suitable for potting of high-end outdoor LED full-color modules

Used for potting protection of high-power electronic components, module power supplies and circuit boards with high requirements for heat dissipation and temperature resistance. Such as module potting, automotive HID lamp module power supplies, automotive ignition system module power supplies, solar panels, transformers, sensors, etc.