Product description
Duobo Electronic Thermal Conductive Potting Glue is a low-viscosity flame-retardant two-component addition-type silicone thermal conductive potting glue. It can be cured at room temperature or heated. The higher the temperature, the faster the curing. This potting AB glue series does not produce any by-products during the curing reaction and can be applied to PC (Poly-carbonate), PP, ABS, PVC and other materials and metal surfaces. It is suitable for thermal conductivity, insulation, waterproofing and flame retardancy of electronic accessories. Its flame retardancy can reach UL94-V0 level and can be used in an environment of -40℃ to 200℃, fully complying with the EU ROHS and REACH directives.
Features and advantages
Good insulation performance
Excellent curing stability
Good potting operation and heat dissipation performance
Comply with EU ROHS and REACH directives
Application
Before mixing: First, stir component A and component B thoroughly.
When mixing: the weight ratio of component A: component B = 1:1 should be followed. Component A should be weighed first, then component B, and stirred evenly.
Degassing: After the rubber is mixed, the rubber should be degassed for 1-3 minutes in a vacuum.
Potting: The mixed rubber should be poured into the product as soon as possible to avoid thickening and poor fluidity of the rubber in the later stage.
Curing: After the rubber is poured, leave it at room temperature for at least 2 hours, and then heat it for aging for 1 hour. The heating temperature should be controlled at 70-90℃.
Application Areas
Potting of outdoor LED display screens
Deep potting of power modules and electronic components, especially suitable for potting of HID power modules,
TV, CRT, power supplies, communication equipment and other electronic and electrical components, as well as bonding and fixing of electronic components Bonding and sealing of
other metals, plastics, glass and other materials with flame retardant requirements
Product Properties
Performance | Component A | Component B |
Before curing | Exterior | Dark gray fluid | White fluid |
Viscosity (cps) | 2500 ～3500 | 2500～3500 |
Operational performance | Component A: Component B (weight ratio) | 1:1 |
Mixed viscosity (cps) | 2500～3500 |
Operation time (min) | 30 |
Curing time (min) | 480 |
Curing time (min, 90℃) | 15 |
After curing | Hardness (Shore A) | 50--60 |
Thermal conductivity [W (m·K)] | ≥0.88 |
Dielectric strength (kv/mm) | ≥27 |
Dielectric constant (1.2MHz) | 3.0～3.3 |
Volume resistivity (Ω·cm) | ≥1.0×10 16 |
Linear expansion coefficient [m/(m·K)] | ≤2.2×10 -4 |
Flame retardant properties | UL 94-V0 |
Operating temperature | Can be used in environments ranging from -40°C to 200°C |
