Two-component A:B=1:1
good insulation performance
Working temperature: -40-200℃
in line with EU ROHS and REACH directives
Application: potting heat dissipation protection of power modules
Two-component A:B=1:1
good insulation performance
Working temperature: -40-200℃
in line with EU ROHS and REACH directives
Application: potting heat dissipation protection of power modules
Duobo Technology's AB glue is used for bonding, sealing and packaging protection of electronic components. After curing, it can play the role of waterproofing, moisture-proof, dust-proof, insulating, heat-conducting, sealing, corrosion-resistant, temperature-resistant and shock-proof. It can improve the performance of electronic and electrical components, strengthen the integrity of electronic devices, improve resistance to external impact and vibration, and improve the insulation between internal components and circuits.
Good insulation performance
Excellent curing stability
Good potting operation and heat dissipation performance
Comply with EU ROHS and REACH directives
Used for heat conduction and potting of heat dissipation components of power modules. After curing, it can play the role of waterproofing, insulation, heat conduction, temperature resistance, and shockproof.
| Test items | unit | NF | NF | NF | Testing standards |
| color | - | A (white) / B (black) | A (white)/B (white) | A (white) / B (black) | Visual inspection |
| Mixing weight ratio | - | 1:1 | 1:1 | 1:1 | Adhesive Analysis and Testing Technology |
| Viscosity of component A | 25℃（mPa*S） | 3500~5000 | 5000~6000 | 1200~1700 | GB/T 2794-1995 |
| Viscosity of component B | 25℃（mPa*S） | 3500~5000 | 1500~2500 | 4500~5500 | GB/T 2794-1995 |
| Viscosity after mixing | 25℃（mPa*S） | 3500~5000 | 1500~3000 | 1200~5500 | GB/T 2794-1995 |
| Mixed density | g/cm 3 | 1.58±0.05 | 1.45±0.05 | 1.4~1.58±0.05 | GB/T 13554-92 |
| Dry time | min | 30~80 | 50~70 | 30~50 | GB/T 13477.5-2002 |
| Operation time | 25℃，min | 30 | 30 | 30 | Adhesive Analysis and Testing Technology |
| Initial solidification time | 25℃，min | 180 | 180 | 180 | Adhesive Analysis and Testing Technology |
| Curing time | 80℃，min | 30 | 30 | 30 | Adhesive Analysis and Testing Technology |
| hardness | Shore A 24h | 45±5 | 50±5 | 20±5~60±5 | GB/T 531.1-2008 |
| Thermal Conductivity | W/mk | 0.7±0.1 | 0.7±0.1 | 0.6±0.05 | ASTM D5470 |
| Volume resistivity | Ω*cm.25℃ | ≥1.0*10 14 | ≥1.0*10 14 | ≥1.0*10 14 | GB/T 1692-2008 |
| Dielectric strength | KV/mm | ≥18 | ≥18 | ≥20 | GB/T 1695-2005 |
| Dielectric constant | 1.2MHz | ≤4.0 | ≤4.0 | ≤4.0 | GB/T 1693-2007 |
| Operating temperature range | ℃ | -40~200 | -40~200 | -40~200 | Adhesive Analysis and Testing Technology |
| Flame retardant properties | UL | 94 V0 | 94 V0 | 94 V0 | UL 94-V fire test |
Thermal Conductivity: 10.0W/M.K
Working Temperature: -40-200℃
Thickness: 0.75-10MM or Customized
Hardness:30-50 shore C
Flaming Rating: UL94 V-0
Ce...
Thermal Conductivity: 8.0W/M.K
Working Temperature: -40-200℃
Thickness: 0.75-10MM or Customized
Hardness:30-50 shore C
Flaming Rating: UL94 V-0
Cer...
Thermal Conductivity: 7.0W/M.K
Working Temperature: -40-200℃
Thickness: 0.75-10MM or Customized
Hardness:30-50 shore C
Flaming Rating: UL94 V-0
Cer...