1.0W/M.K Silicone Thermal Grease
1.0W/M.K Silicone Thermal Grease

1.0W/M.K Silicone Thermal Grease

1.0W/M.K Silicone Thermal Grease

Conductivity:1.0W/M.K

Resistance:<0.25℃-in²/W

Working Temperature:-40-200℃

Certification : ROHS,REACH

Packing Suggestion:150ML,600ML,2600ML


Conductivity:1.0W/M.K

Resistance:<0.25℃-in²/W

Working Temperature:-40-200℃

Certification : ROHS,REACH

Packing Suggestion:150ML,600ML,2600ML


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1.0W/M.K Silicone Thermal Grease Apply For Quotation
Introduction

DUOBO 1.0W/M.K Silicone Thermal Grease is a high-performance thermal interface material designed to efficiently conduct heat between electronic components and heat sinks. This product excels in minimizing thermal resistance and optimizing heat transfer, which is critical for maintaining the reliability and longevity of electronic devices. Ideal for a variety of applications, our silicone thermal grease ensures your devices operate within optimal temperature ranges, preventing overheating and improving overall performance.

Features

High Thermal Conductivity: With a thermal conductivity rating of 1.0W/M.K, this grease provides superior heat dissipation.

Stable Performance: Maintains consistent performance across a wide temperature range, ensuring reliable operation in varying conditions.

Non-Corrosive: Formulated to be non-corrosive, protecting sensitive electronic components from damage.

Easy Application: The grease's smooth consistency allows for easy application, ensuring a uniform layer and efficient thermal transfer.

Low Thermal Resistance: Designed to reduce thermal resistance, enhancing the cooling efficiency of electronic devices.

Application method

Preparation: Ensure both the component and heat sink surfaces are clean and free of any old thermal grease, dust, or debris.

Application: Apply a small amount of silicone thermal grease to the center of the component.

Spreading: Using a spatula or the component itself, spread the grease evenly to form a thin, uniform layer.

Assembly: Carefully place the heat sink on top of the component and press gently to secure. Ensure the thermal grease fills any gaps to maximize thermal conductivity.

Application
CPUs and GPUs
Power transistors and semiconductors
LED lighting modules
Automotive electronics
Communication devices
Industrial control systems
Specification
Testing Item Unit Testing Method Testing Value
Colour - Visual White or customized
Thermal Resistance ℃-in2/W ASTM D5470 ≤0.25
Component Ratio - ASTMD1475 2.0
Evaporation % Fed.Std.791 0.001
Oil Precipitation % Fed.Std.791 0.05
 Dielectric Constant - ASTM D150 5
Viscosity ( mPa.s@25) DHR-2 (100~300)*104
Cone Penetration 1/10 MM GB/T-269 410±10
Working Temperature - -40~200
Flaming Rating - UL 94 V0
Weight loss % 1 @200°200H
Density g/cc 2.2±0.3 ASTM D792
Thermal Conductivity W/M.K ASTM D5470 1.0 
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