Introduction

DUOBO 0.7mm Thermal Conductive Adhesive Tape is designed with a robust fiberglass base and dual-sided adhesive, offering a strong, reliable bond that can even replace screws in certain applications. With a thermal conductivity of 1.2W/m.k and operational temperature range of -20°C to 120°C, this tape is ideal for applications requiring superior thermal management and structural stability. It is particularly effective in securing heat-generating components to heat sinks, chassis, or enclosures, addressing issues of heat dissipation and mechanical fasteners.

Features

●  Dual-Sided Adhesion: Provides strong, reliable bonding on both sides, capable of replacing screws and mechanical fasteners.

●  Thermal Conductivity: Transfers heat efficiently with a thermal conductivity of 1.2W/m.k.

●  Temperature Resistance: Operates effectively in temperatures ranging from -20°C to 120°C, suitable for a variety of environments.

●  Tear Resistance: The fiberglass base offers enhanced durability and resistance to tearing.

●  Strong Adhesion: Delivers excellent bonding strength to various surfaces.

●  Electrical Insulation: Provides reliable electrical insulation to protect sensitive components.

Application method

●  Surface Preparation: Clean and dry the surfaces to ensure they are free from dust, grease, and contaminants.

●  Cutting and Peeling: Cut the tape to the required size, then peel off the protective liners from both sides.

●  Positioning: Align and place the tape between the heat-generating component and the heat sink or other surfaces.

●  Application of Pressure: Apply firm pressure to ensure a secure bond and full contact between surfaces.

●  Setting Time: Allow the adhesive to set as per the recommended time for achieving maximum strength and performance.

Application

● Power Electronics: Ideal for securing heat sinks to power modules and converters.
● High-Performance Computing: Used in CPUs, GPUs, and other high-heat-generating computer components.
● Consumer Electronics: Provides effective thermal management in smartphones, tablets, and laptops.
● Automotive Applications: Secures components and manages heat in automotive electronic systems.
● Industrial Equipment: Enhances heat dissipation and component stability in various industrial machines and devices.

Specification