Introduction
DUOBO 0.5mm Thermal Conductive Adhesive Tape features a fiberglass base and a dual-sided adhesive layer, providing exceptional bonding and heat transfer capabilities. With a thermal conductivity of 1.2W/m.k and the ability to function effectively in temperatures from -20 to 120℃, this tape is designed for applications where robust thermal management is crucial. It is ideal for use between heat-generating components and heat sinks, or within electronic assemblies that require secure, long-lasting thermal interfaces. This tape resolves overheating issues, ensuring consistent performance and extending the lifespan of electronic devices.
Features
● High Thermal Conductivity: Efficiently transfers heat with a thermal conductivity of 1.2W/m.k.
● Tear Resistance: Enhanced durability with resistance to tearing, thanks to the fiberglass base.
● Flexibility and Conformability: Easily conforms to irregular surfaces for comprehensive coverage.
Application method
Surface Preparation: Clean and dry the surfaces to be bonded, ensuring they are free from dust, oil, and contaminants.
Tape Cutting: Cut the tape to the appropriate size for your application.
Peeling and Placement: Peel off the protective liners from both sides of the tape and position it between the heat-generating component and the heat sink or other surfaces.
Pressure Application: Apply firm pressure to ensure full contact and secure adhesion.
Curing Time: Allow the adhesive to set as per the manufacturer's recommendations to achieve optimal performance.
Application
● Power Electronics: Ideal for use in power converters and modules where efficient heat transfer is critical.
● Computer Components: Enhances thermal management in CPUs, GPUs, and other high-performance computing elements.
● Consumer Electronics: Applied in smartphones, tablets, and other devices to manage heat effectively.
● Industrial Machinery: Ensures reliable heat dissipation in various types of industrial equipment.
● Telecommunications Hardware: Manages heat in communication devices and networking equipment.
Specification
| Testing Item
| Unit
| Testing Value
| Testing Method
|
| Substrate
| -
| Glass Fabric
| -
|
| Colour
| -
| White
| Visual
|
| Thickness
| MM
| 0.5
| -
|
| Peel Strength under 180°
| (PSTC-101)(N/25MM)
| ＞19
| PSTC-1
|
| Retention
| （1KG/INCH/25℃）
| ＞48
| PSTC-1
|
| Adhesion
| KG/IN
| 1.5
| PSTC-1
|
| Initial Viscosity
| KG/IN
| 1.5
| PSTC-1
|
| Breakdown Voltage
| KV/MM
| 7
| ASTM D149
|
| Long-term Highest Temperature resistance
| ℃
| 80
| EN 344
|
| Short-term Highest Temperature
| ℃
| 120
| EN 344
|
| Working Temperature
| ℃
| -20～120
| EN 344
|
| Conductivity
| W/M.K
| ≥1.2
| ASTM D5470
|
