Introduction

DUOBO 1.0mm Thermal Conductive Adhesive Tape is engineered with a fiberglass fabric base and dual-sided adhesive, designed for heavy-duty thermal management and structural reinforcement. This tape features a thermal conductivity of 1.2W/m.k and operates effectively within a temperature range of -20°C to 120°C. Ideal for applications where heat dissipation and mechanical stability are crucial, it can replace traditional mechanical fasteners like screws. This tape provides a secure and reliable thermal interface between heat-producing components and heat sinks or enclosures, addressing heat management challenges and enhancing overall device reliability.

Features

●  Dual-Sided Adhesion: Offers strong bonding on both sides, making it a viable replacement for mechanical fasteners.

●  High Thermal Conductivity: Efficiently transfers heat with a conductivity of 1.2W/m.k.

●  Temperature Tolerance: Suitable for use in a wide temperature range from -20°C to 120°C.

●  Tear-Resistant: Durable with a fiberglass base that resists tearing under stress.

●  Strong Adhesion: Provides superior bonding strength to various surfaces.

●  Electrical Insulation: Ensures safe operation with effective electrical insulation properties.

Application method

●  Surface Preparation: Ensure surfaces are clean, dry, and free of contaminants such as dust and grease.

●  Cutting: Trim the tape to the required dimensions for your specific application.

●  Peeling and Placement: Remove the protective liners from both sides of the tape and position it between the heat-generating component and the heat sink or enclosure.

●  Applying Pressure: Firmly press the tape into place to ensure strong adhesion and complete contact.

Application

● High-Power Electronics: Ideal for heat management in power supplies, transformers, and other high-heat generating electronic components.
● Industrial Machinery: Used to secure and manage heat in industrial equipment and machinery.
● Automotive Systems: Applies to automotive electronics where effective heat dissipation is necessary.
● Data Centers: Enhances thermal management in servers and other critical data center equipment.
● Consumer Devices: Provides robust thermal and structural support for devices such as high-performance laptops and gaming consoles.

Specification