Duobo 150-35 0-N (thermal conductivity 3.5W/mk) thermal mud is made of organic silicon as the matrix and filled with thermally conductive metal powder. The thermal mud is a non-curing, high adaptability, low stress thermal interface material. The application process can be made into high-compression sheet products according to customer needs or made into a semi-fluid state to meet the automatic dispensing process. It has efficient thermal conductivity and excellent gap-filling effect. It is a perfect seal between the radiator and the substrate. One of the best thermal interface material options.

Thermal conductivity 3.5 W/mK

Young's modulus is small 

No silicone oil precipitation, no pollution

High electrical insulation

High compression, low stress

Good temperature resistance

Low compression force applications

Automated operations possible

First clean the surface to be applied, then stir the thermal mud evenly, and then apply it on the product contact surface by spot coating. After the operation is completed, the unused product should be sealed and stored in time. You can squeeze out the appropriate amount with a hand-squeezed hose according to your own dosage, or install a special extruder for extrusion. The glue thickness should not exceed 6mm, and avoid contact with eyes when applying glue.

Power batteries, semiconductor blocks and radiators, power connectors, electronic equipment and peripheral applications, applications between thermal conductive heat sources and radiators

Test items	unit	parameter	standard test
Thermal Conductivity	w/mk	3.5(±0.2)	ASTM D5470
Thermal resistance	℃in 2 /W	≤0.9	ASTM D5470
color	-	Pink	Visual inspection
viscosity	mPa.s@25℃	75*10 4	Rheometer DHR-2
density	g/cc	3.2(±0.5)	ASTM D792
Extrusion rate	g	25	g/min(50MPa)
	g	40	g/min(100MPa)
Flammability rating	-	UL94 V0 5V	UL-94
temperature range	℃	-40~200	IEC 60068-2-14
Breakdown voltage	Kv/mm	≥7	ASTM D149
Volume resistivity	Ω*CM	≥1.0*10 11	ASTM D257