Duobo 150-1 00 -N (1.0W/mk) thermal mud is based on organic silicon and filled with thermally conductive metal powder. The thermal mud is a non-curing, high adaptability, low stress thermal interface material. The application process It can be made into high-compressibility sheet products according to customer needs or made into a semi-fluid state to meet the automatic dispensing process. It has efficient thermal conductivity and excellent gap-filling effect. It is the best for unevenness between the radiator and the substrate. One of the options for thermal interface materials .

Thermal conductivity 1.0W/mK

Young's modulus is small 

No silicone oil precipitation, no pollution

High electrical insulation

High compression, low stress

Good temperature resistance

Low compression force applications

Automated operations possible

First clean the surface to be applied, then stir the thermal mud evenly, and then apply it on the product contact surface by spot coating. After the operation is completed, the unused product should be sealed and stored in time. You can squeeze out the appropriate amount with a hand-squeezed hose according to your own dosage, or install a special extruder for extrusion. The glue thickness should not exceed 6mm, and avoid contact with eyes when applying glue.

Power batteries, semiconductor blocks and radiators, power connectors, electronic equipment and peripheral applications, applications between thermal conductive heat sources and radiators