7W Laptop CPU Putty - Cuts Temperature by 35°C in Under 5 Minutes

Color: white, grey
Material: silicone, ceramic
Customization: available
Temperature Range: -40~150℃
Application: Power-supply module, LED products, Engine controller

TM series

Thermal Mud

The thermal putty, which feels close to plasticine. It is based on silicon gel and filled with a variety of high-performance ceramic powders. Thermal putty has the characteristics of high thermal conductivity, low thermal resistance, good adhesion to heat sink parts, permanent drying, insulation, automatic filling of gaps, maximum limited contact area, infinite compression and so on.

Product Features

● l Excellent electrical insulation

● l Low plasticity and plasticine, easy to cooperate.

● l Non-drying, non-solidification, non-melting, tasteless and non-toxic.

Typical Applications

● l Power-supply module, LED products, Engine controller

Technical Data Sheet

Test Item	Unit	Nominal Value
		TM-10	TM-20	TM-30	TM-40	TM-50	TM-60	TM-70	TM-80
Composition material	-	Ceramic + Silicone
Color	-	White	Off-white	Grey	Grey	Grey	Grey	Grey	Grey
Density	g/cc	2.1±0.1	2.7±0.1	2.9±0.1	3.3±0.1	3.3±0.1	3.4±0.1	3.4±0.1	3.5±0.1
Extrudability	g/s	6.5	6	5	2.5	2.5	2.5	1.5	1
Temperature range	℃	-40~150	-40~150	-40~150	-40~150	-40~150	-40~150	-40~150	-40~150
Breakdown voltage	KV/mm	≥5.0	≥5.0	≥5.0	≥5.0	≥5.0	≥5.0	≥5.0	≥5.0
Volume resistivity	Ω.cm	10^14	10^14	10^14	10^14	10^14	10^14	10^14	10^14
Dielectric constant	@10MHz	≥5.0	≥5.0	≥6.0	≥6.0	≥6.0	≥7.0	≥7.0	≥8.0
Fire rating	-	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0
Thermal conductivity	W/m-k	1±0.1	2±0.2	3±0.3	4±0.4	5±0.5	6±0.6	7±0.7	8±0.8
Thermal resistance 0.3mm@50pis	°C-in2/W	0.2	0.18	0.15	0.1	0.08	0.08	0.07	0.05

Packing Specification

Packed in drums, 1 kg /5 kg /10 kg /20 kg in regular packaging.

Storage: Keep away from light, heat, and seal (can be transported and stored as non-dangerous goods)