0.1mm Thermal Conductive Adhesive Tape
0.1mm Thermal Conductive Adhesive Tape

0.1mm Thermal Conductive Adhesive Tape

0.1mm Thermal Conductive Adhesive Tape
Adhesive:Acrylic
Thickness:0.1MM
Material:Glass fiber
Thermal Conductivity:1.2W/m.k
Adhesive Type:Pressure Sensitive
Temperature Resistance:-20-120℃
Breakdown Voltage:≥2Kv/mm
Adhesive:Acrylic
Thickness:0.1MM
Material:Glass fiber
Thermal Conductivity:1.2W/m.k
Adhesive Type:Pressure Sensitive
Temperature Resistance:-20-120℃
Breakdown Voltage:≥2Kv/mm
Contact Us
0.1mm Thermal Conductive Adhesive Tape Apply For Quotation

Introduction

DUOBO 0.7mm Thermal Conductive Adhesive Tape is designed with a robust fiberglass base and dual-sided adhesive, offering a strong, reliable bond that can even replace screws in certain applications. With a thermal conductivity of 1.2W/m.k and operational temperature range of -20°C to 120°C, this tape is ideal for applications requiring superior thermal management and structural stability. It is particularly effective in securing heat-generating components to heat sinks, chassis, or enclosures, addressing issues of heat dissipation and mechanical fasteners.




Features

●  Dual-Sided Adhesion: Provides strong, reliable bonding on both sides, capable of replacing screws and mechanical fasteners.

●  Thermal Conductivity: Transfers heat efficiently with a thermal conductivity of 1.2W/m.k.

●  Temperature Resistance: Operates effectively in temperatures ranging from -20°C to 120°C, suitable for a variety of environments.

●  Tear Resistance: The fiberglass base offers enhanced durability and resistance to tearing.

●  Strong Adhesion: Delivers excellent bonding strength to various surfaces.

●  Electrical Insulation: Provides reliable electrical insulation to protect sensitive components.




Application method

●  Surface Preparation: Clean and dry the surfaces to ensure they are free from dust, grease, and contaminants.

●  Cutting and Peeling: Cut the tape to the required size, then peel off the protective liners from both sides.

●  Positioning: Align and place the tape between the heat-generating component and the heat sink or other surfaces.

●  Application of Pressure: Apply firm pressure to ensure a secure bond and full contact between surfaces.

●  Setting Time: Allow the adhesive to set as per the recommended time for achieving maximum strength and performance.




Application

● Power Electronics: Ideal for securing heat sinks to power modules and converters.
● High-Performance Computing: Used in CPUs, GPUs, and other high-heat-generating computer components.
● Consumer Electronics: Provides effective thermal management in smartphones, tablets, and laptops.
● Automotive Applications: Secures components and manages heat in automotive electronic systems.
● Industrial Equipment: Enhances heat dissipation and component stability in various industrial machines and devices.




Specification

Testing ItemUnitTesting ValueTesting Method
Substrate-Glass Fabric-
Colour-WhiteVisual
ThicknessMM0.1-
Peel Strength under 180°(PSTC-101)(N/25MM)13PSTC-1
Retention1KG/INCH/25°C48PSTC-1
AdhesionKG/IN1.1PSTC-1
Initial ViscosityKG/IN0.6PSTC-1
Breakdown VoltageKV/MM2ASTMD149
Long-term Highest Temperature resistance°C80EN344
Short-term Highest Temperature°C120EN344
Working Temperature°C-20°C120°CEN344
ConductivityW/M.K≥1.2ASTM D5470
Related Products
2W/MK High Thermal Conductivity Single Component Silicone Paste
2W/MK High Thermal Conductivity Single Component Silicone Paste
2W/MK High Thermal Conductivity Single Component Silicone Paste

More  >
1W/MK Single Component Thermal Conductive Silicone for Electronics
1W/MK Single Component Thermal Conductive Silicone for Electronics
1W/MK Single Component Thermal Conductive Silicone for Electronics

More  >
6W Two-Part Thermal Gel | High Thermal Conductivity, Low Thermal Resistance
6W Two-Part Thermal Gel | High Thermal Conductivity, Low Thermal Resistance
6W Two-Part Thermal Gel | High Thermal Conductivity, Low Thermal Resistance

More  >
Copyright © 2020 Duobo New Materials Co.,Ltd All rights reserved