PS Heat-conducting Potting Compound is a kind of low viscosity flame retardant two component addition type silicone thermal conductive potting adhesive, which can be cured at room   temperature or by heating, and has the characteristics that the higher the temperature is, the   faster the curing speed is. The product does not produce any byproducts in the curing   reaction, and can be applied to the surfaces of PC (poly-carbonate), PP, ABS,   PVC and other materials and metals.It is suitable for heat conduction, insulation,  waterproof, sealing and flame retardant of electronic accessories.

Product features

. Two-component, 1:1 mix for full and deep curing.

. High temperature resistance, low shrinkage and low expansion rate.

. Thermal conductivity, insulation, good dielectric properties.

. Resistant to vibration, moisture, corrosion, and the environment

. Prevent mechanical damage and have repairable function.


A silicone rubber potting compound is used to insulate or conceal electrical circuitry in professional and industrial applications.

• Good fluidity and easy to pot;

• Curable at room temperature or by heating;

• UL94-V0 flame retardant grade;

• 100% solid, no curing byproducts;

• Working temperature -50ºC~200ºC;

• Fully compliant with ROHS directive requirements.

Thermal Interface Material can be used in 36 electronics industry, here are some application examples.
1. LED lighting, LED TV
2. Backlight module, switching power supply
3. Medical equipment, communication equipment
4. Mobile device, 5G network products
5. Video equipment, home appliances
6. PC server/workstation, base station

Technical Data Sheet